型号:HG1000CMP抛光垫;白色;
  硬度:邵D60±5;无填料;
  密度:0.85±5;
  适用于半导体晶体和硬质合金的精密抛光。可使被加工工件的抛光平整度更加一致,划伤度更低。

  Model:HG1000CMP Polishing Pad;
  Color:White;
  Hardness:Shore D60±5;No Fillers;
  Density:0.85±0.05;
  Suitable for precision polishing of semiconductor crystals and hard alloys.It enables a more consistent flatness and lower scratch levels on the processed workpieces.