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参考报价：电议 型号：
产地：德国 在线咨询
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真空回流焊：
| Process environment | nitrogen， inert gas， formic acid， forming gas |
| Maximum temperature | 450°C |
| Heating area | 420 x 420 mm |
| Heating plate | removable: graphite， aluminum， etc. |
| Clearance above heating plate | 60 mm |
| Heat up / cool down ramp | 250°C/min |
| Control deviation | +/- 0.5°C |
| Heating elements | 16x infrared heating lamps in two crossed rows |
| Heating control | individual/adjustable on every heating lamp |
| Cooling of heating plate | nitrogen flow |
| Temperature measurement | up to 4x thermocouples K-Type freely positional |
| Pressure measurement | full range over two gauges |
| Maximum vacuum | 1x10-2 mbar (5x10-6 mbar with turbo pump) |
| Formic acid bubbler | 40 ml container in front panel with auto refill |
| Cooling of chamber body | water/ethylene glycol mixture |
| Lid viewing port | 80 mm with shutter |
| Display | 7" LCD with touch screen |
| PC Software | process logging， recipe transfer， etc. |
| User interface | remote control over relay I/Os |
| Dimensions | see layout |
| Weight | 280 kg |
| Power supply | 3 phase， country specific |
**客户：
应用：
在真空和惰性气体中加热、散热器上的功率半导体、倒装芯片回流焊、凸点熔化、高强度LED连接、密封封装密封、光伏电池组件、模具连接、印刷铜膜烧结、混合电路组件、扁平封装封装、微机电系统和光电器件封装，汽车传感器、高能电池等。
