铂悦仪器(上海)有限公司
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    漆膜附着力测试

    Film adhesion testing of thin films and stacks on substrates for material evaluation

    3DIC TSV and BWS TTV硅片表面形貌测量

    Film Stress薄膜应力量测仪

    FEOL Electrical Characterization 电学特性

    Thin wafer metrology 晶圆测量学

    Film Adhesion漆膜附着力测试

    Film adhesion testing

    of thin films and stacks on substrates

    for material evaluation.

    FSM offers two techniques suitable for low and medium adhesion strength tests.