生益科技
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  • 参考报价:电议
    型号:封装基板用高性能基板材料
    产地:江苏
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  • 详细介绍:



    产品性能:

    Remarks:

    1. These properties were measured with 0.80mm laminates except for XY-CTE that was measured with 0.10mm laminates.

    2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

    Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

    The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

    ItemsConditionUnitSI10USI10U LC
    TgDMA270270
    Td5% wt. loss
    >400>400
    T300
    TMAmin>60>60
    CTE (X/Y-axis)Before Tgppm/℃
    107
    Dissipation Constant (1GHz)2.5.5.9-4.64.2
    Dissipation Factor (1GHz)
    2.5.5.9-0.0060.006
    Peel Strength12 um LPN/mm
    0.80.8
    Flexural ModulusAGPa
    3032
    Water AbsorptionC-168/85/85%
    0.350.35
    Flammability
    UL-94Rating
    V-0V-0
    Heat Resistance300℃/solder dips
    >300>300
    Heat Resistance after Moisture absorption
    PCT 5h+288℃solder 20s
    -Pass Pass
    Halogen free
    --Yes
    Yes
    Glass
    --E glassLow CTE-glass