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  • 参考报价:电议
    型号:无卤,高CTI,胶膜型铝基覆铜板
    产地:江苏
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  • 详细介绍:


    Remarks:

    1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.

    2. All  the typical values listed above are for your reference only and not  intended for specification. Please contact Shengyi Technology Co., Ltd.  for detailed information. All rights from this data sheet are reserved  by Shengyi Technology Co., Ltd.  

    Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning  

    The first digit following the letter indicates the  duration of preconditioning in hours, the second digit the  preconditioning temperature in ℃ and the third digit the relative humidity.

    ItemsMethodConditionUnitTypical Value
    Thermal ConductivityASTM-D5470AW/ (m•K) 2.1
    Thermal ResistanceASTM-D5470AK·cm2/W  0.52
    Tg2.4.25DDSC160
    Td
    2.4.24.6Wt 5% loss395
    Thermal Stress2.4.13.1288℃, solder floatmin
    30
    CTE (Z-axis)2.4.24Before Tgppm/℃17
    After Tgppm/℃39
    50-260℃%0.69
    Volume Resistivity2.5.17.1C-96/35/90MΩ.cm108  
    Surface Resistivity
    2.5.17.1
    C-96/35/90108  
    Dielectric Breakdown2.5.6D-48/50+D-0.5/23kV5.0
    Hi-pot TestCPCA4105-2012DCV4000
    ACV3000
    Peel Strength (1oz)2.4.8288℃/10sN/mm1.3
    Flammability
    UL94
    C-48/23/50
    Rating
    V-0
    MOTULA130
    CTIIEC60112ARatingPLC0