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  • 参考报价:电议
    型号: LNB33
    产地:江苏
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  • 详细介绍:


    LNB33

    高频电路用电子级玻璃纤维布增强碳氢陶瓷基覆铜板

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    产品性能:

    Remarks:

    All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

    Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
    The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

    ItemsMethodConditionUnitTypical Value
    Dielectric Constant,
    Process Dk
    IPC-TM-650 2.5.5.5C-24/23/50, 10GHz-3.30±0.05
    Dielectric Constant, DkIEC 61189-2-721C-24/23/50, 10GHz-3.45±0.05
    Dissipation Factor, DfIPC-TM-650 2.5.5.5C-24/23/50, 10GHz-0.0025
    IEC 61189-2-721C-24/23/50, 10GHz-0.0032
    Thermal Coefficient of DkIEC 61189-2-721
    -40~150℃, 10GHzppm/℃+125
    Volume ResistivityIPC-TM-650 2.5.17.1AMΩ·cm6.8 x 108
    Surface Resistivity
    IPC-TM-650 2.5.17.1
    A5.3 x 107
    TgIPC-TM-650 2.4.25DSC>280
    TdIPC-TM-650 2.4.24.65% wt. loss>400
    CTE (Z-axis)IPC-TM-650 2.4.2430-260℃ppm/℃55
    CTE (X/Y-axis)
    IPC-TM-650 2.4.4130-260℃ppm/℃13/15
    Peel StrengthIPC-TM-650 2.4.8288℃/10sN/mm [lb/in]1.0 [5.71]
    Flexual StrengthIPC-TM-650 2.4.4AMPa235
    Water AbsorptionIPC-TM-650 2.6.2.1D-24/23%0.1
    Thermal Conductivity
    ASTM D5470100℃W/(m·k)0.69
    Tensile Modulus (LW/CW)ASTM D638AGPa
    15.6/19.7
    Tensile Strength (LW/CW)ASTM D638AMPa112/143