生益科技
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  • 参考报价:电议
    型号:S1130
    产地:江苏
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  • 详细介绍:


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    产品性能:

    ItemsMethodConditionUnitTypical V
    alue
    TgIPC-TM-650 2.4.25DSC135
    TdIPC-TM-650 2.4.24.65% wt. loss310
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
    After Tgppm/℃310
    50-260℃%4.5
    T260IPC-TM-650 2.4.24.1TMAmin13
    T288IPC-TM-650 2.4.24.1TMAmin<1
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S  No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm4.8E + 08
    E-24/125MΩ.cm4.6E + 06
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.2E + 07
    E-24/1255.3E + 06
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
    Electrical StrengthIPC-TM-650 2.5.6.2D-48/50+D-4/23kV/mm
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
    IEC 61189-2-72110GHz--
    Peel Strength(1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.8
    125℃N/mm1.6
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
    CWIPC-TM-650 2.4.4AMPa500
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
    CTIIEC30112C-48/23/50,PLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

    Remarks:

    1. Specification sheet: IPC-4101/21, is for your reference only.

    2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

    3. All  the typical values listed above are for your reference only and not  intended for specification. Please contact Shengyi Technology Co., Ltd.  for detailed information. All rights from this data sheet are reserved  by Shengyi Technology Co., Ltd.

    Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

    The  first digit following the letter indicates the duration of  preconditioning in hours, the second digit the preconditioning  temperature in and the third digit the relative humidity.